.

An effective solution to thermal-aware test scheduling on network-on-chip using multiple clock rates

LAUR Repository

Show simple item record

dc.contributor.author Harmanani, Haidar
dc.contributor.author Salamy, Hassan
dc.date.accessioned 2017-03-28T13:11:39Z
dc.date.available 2017-03-28T13:11:39Z
dc.date.issued 2017-03-28
dc.identifier.isbn 978-1-4673-2527-1 en_US
dc.identifier.uri http://hdl.handle.net/10725/5447
dc.description.abstract As more cores are being packed on a single chip, bus-based communication is suffering from bandwidth and scalability issues. As a result, the new approach is to use a network-on-chip (NoC) as the main communication platform on a SoC. NoC provides the flexibility and scalability much needed in the era of multi-cores. NoC-based systems also provide the capability of multiple clocking that is widely used in many SoC nowadays. In this paper, a simulated annealing algorithm for thermal and power-aware test scheduling of cores in a NoC-based SoC using multiple clock rates is presented. Results on different benchmarks show the effectiveness of our technique. en_US
dc.language.iso en en_US
dc.publisher IEEE en_US
dc.title An effective solution to thermal-aware test scheduling on network-on-chip using multiple clock rates en_US
dc.type Conference Paper / Proceeding en_US
dc.author.school SAS en_US
dc.author.idnumber 199490170 en_US
dc.author.department Computer Science and Mathematics en_US
dc.description.embargo N/A en_US
dc.keywords Clocks en_US
dc.keywords System-on-a-chip en_US
dc.keywords Scheduling en_US
dc.keywords Benchmark testing en_US
dc.keywords Schedules en_US
dc.keywords Safety en_US
dc.identifier.doi http://dx.doi.org/10.1109/MWSCAS.2012.6292074 en_US
dc.identifier.ctation Salamy, H., & Harmanani, H. (2012, August). An effective solution to thermal-aware test scheduling on network-on-chip using multiple clock rates. In Circuits and Systems (MWSCAS), 2012 IEEE 55th International Midwest Symposium on (pp. 530-533). IEEE. en_US
dc.author.email haidar.harmanani@lau.edu.lb en_US
dc.conference.date 5-8 Aug. 2012 en_US
dc.conference.pages 530-533 en_US
dc.conference.place Boise, ID, USA en_US
dc.conference.title 2012 IEEE 55th International Midwest Symposium on Circuits and Systems en_US
dc.identifier.tou http://libraries.lau.edu.lb/research/laur/terms-of-use/articles.php en_US
dc.identifier.url http://ieeexplore.ieee.org/abstract/document/6292074/ en_US
dc.author.affiliation Lebanese American University en_US


Files in this item

This item appears in the following Collection(s)

Show simple item record

Search LAUR


Advanced Search

Browse

My Account