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Thermal-aware test scheduling using network-on-chip under multiple clock rates

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dc.contributor.author Harmanani, Haidar M.
dc.contributor.author Salamy, Hassan
dc.date.accessioned 2016-04-11T11:47:24Z
dc.date.available 2016-04-11T11:47:24Z
dc.date.copyright 2013
dc.date.issued 2017-07-27
dc.identifier.issn 0020-7217 en_US
dc.identifier.uri http://hdl.handle.net/10725/3526
dc.description.abstract The increasing trend in the number of cores on a single chip has led to scalability and bandwidth issues in bus-based communication. Network-on-chip (NoC) techniques have emerged as a solution that provides a much needed flexibility and scalability in the era of multi-cores. This article presents an optimal integer linear programming (ILP) formulation and a simulated annealing (SA) solution to thermal and power-aware test scheduling of cores in an NoC-based SoC using multiple clock rates. The methods have been implemented and results on various benchmarks are presented. en_US
dc.language.iso en en_US
dc.title Thermal-aware test scheduling using network-on-chip under multiple clock rates en_US
dc.type Article en_US
dc.description.version Published en_US
dc.author.school SAS en_US
dc.author.idnumber 199490170 en_US
dc.author.woa N/A en_US
dc.author.department Computer Science and Mathematics en_US
dc.description.embargo N/A en_US
dc.relation.journal International Journal of Electronics en_US
dc.journal.volume 100 en_US
dc.journal.issue 3 en_US
dc.article.pages 408-424 en_US
dc.keywords Network-on-chip en_US
dc.keywords Test scheduling en_US
dc.keywords SoC en_US
dc.keywords ILP en_US
dc.keywords Simulated annealing en_US
dc.identifier.doi http://dx.doi.org/10.1080/00207217.2012.713016 en_US
dc.identifier.ctation Salamy, H., & Harmanani, H. M. (2013). Thermal-aware test scheduling using network-on-chip under multiple clock rates. International Journal of Electronics, 100(3), 408-424. en_US
dc.author.email haidar.harmanani@lau.edu.lb
dc.identifier.url http://www.tandfonline.com/doi/abs/10.1080/00207217.2012.713016


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